Sicoya GmbH, a spin off from TU Berlin, is developing silicon photonics (SiPh) based photonic integrated circuits (PICs) for optical data center interconnects using a fabless business model. The team consists of 13 employees which raised 4.2 M€ of nonrepayable public fund for R&D in the last 8 years.
Sicoya aims to enter the market in two years with a 4x25 Gbit/s sealed and packaged transceiver chip for intra data center connections with link distances up to 2 km. Sicoya designs, packages and sells Silicon photonic based Application Specific Photonic Integrated Circuits (ASPICs) similar to the ASIC business in microelectronics. ASPICs will be made available either as bare dies or as packaged chips utilizing a novel packaging approach for very low manufacturing costs. Sicoya’s ASPICs will revolutionize the way photonics is used and will enable next generation data centers.